







THERM PAD 228.6MMX228.6MM PINK
CONN HEADER SMD 32POS 2.54MM
IC SRAM 16KBIT PARALLEL 64TQFP
PACK ROUND 1 POS 74MM D 47.3MMH
| Type | Description |
|---|---|
| Series: | Tflex™ HD700 |
| Package: | Box |
| Part Status: | Active |
| Usage: | - |
| Type: | Gap Filler Pad, Sheet |
| Shape: | Square |
| Outline: | 228.60mm x 228.60mm |
| Thickness: | 0.0800" (2.032mm) |
| Material: | Silicone, Ceramic Filled |
| Adhesive: | Tacky - Both Sides |
| Backing, Carrier: | - |
| Color: | Pink |
| Thermal Resistivity: | - |
| Thermal Conductivity: | 5.0W/m-K |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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