







CAP CER 0603 91PF 25V ULTRA STAB
MEMS OSC XO 106.2500MHZ LVCMOS
CONN RCPT 32POS 0.1 GOLD PCB
THERM PAD 228.6MMX228.6MM PINK
| Type | Description |
|---|---|
| Series: | Tflex™ HD300 |
| Package: | Box |
| Part Status: | Active |
| Usage: | - |
| Type: | Gap Filler Pad, Sheet |
| Shape: | Square |
| Outline: | 228.60mm x 228.60mm |
| Thickness: | 0.0700" (1.778mm) |
| Material: | Silicone, Ceramic Filled |
| Adhesive: | Tacky - Both Sides |
| Backing, Carrier: | - |
| Color: | Pink |
| Thermal Resistivity: | - |
| Thermal Conductivity: | 2.7W/m-K |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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