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MC33PF8200DBESR2

MC33PF8200DBESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

MC33PF8200DBESR2

MC33PF8200DBESR2

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Part No :

MC33PF8200DBESR2

Manufacturer
NXP Semiconductors
Description
POWER MANAGEMENT IC I.MX8 PRE-PR
Catalog
PMIC - Power Management - Specialized
Availability
766076 pieces
Shipped from
HK warehouse
Expected Shipping Date
May 22 - May 26 2024
Type Description
Series:-
Package:Tape & Reel (TR)
Part Status:Active
Applications:High Performance i.MX 8, S32x Processor Based
Current - Supply:-
Voltage - Supply:2.5V ~ 5.5V
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount, Wettable Flank
Package / Case:56-VFQFN Exposed Pad
Supplier Device Package:56-HVQFN (8x8)
MC33PF8200DBESR2 is available at GangBo-ic.com, Please review product page below for detailed information, including MC33PF8200DBESR2 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for MC33PF8200DBESR2 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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Phone: 00852-52612101

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