IC TEMP SWITCH DL TRIP SOT23-6
IC CLK BUFFER LVPECL 16TSSOP
CONN HDR 64POS SMD GOLD
FERRI-UFS BGA 153-B EMMC 3D TLC
Type | Description |
---|---|
Series: | Power Q2™ QMS |
Package: | Tray |
Part Status: | Active |
Connector Type: | Header, Outer Shroud Contacts |
Number of Positions: | 64 |
Pitch: | 0.025" (0.64mm) |
Number of Rows: | 2 |
Mounting Type: | Surface Mount |
Features: | Ground Bus (Plane) |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Mated Stacking Heights: | 10mm, 12mm |
Height Above Board: | 0.212" (5.38mm) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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