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Part No :

40-6554-10

Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET ZIF 40POS TIN
Catalog
Sockets for ICs, Transistors
Availability
10207 pieces
Shipped from
HK warehouse
Expected Shipping Date
Oct 26 - Oct 30 2025
PDF
40-6554-10 PDF
Type Description
Series:55
Package:Bulk
Part Status:Active
Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):40 (2 x 20)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:200.0µin (5.08µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-
40-6554-10 is available at GangBo-ic.com, Please review product page below for detailed information, including 40-6554-10 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 40-6554-10 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

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