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SiT3372AC-2E9-28NC50.000000T

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24-6554-16

24-6554-16

CONN IC DIP SOCKET ZIF 24POS

SIP1X16-014BLF

SIP1X16-014BLF

CONN SOCKET SIP 16POS TIN

24-6554-16

24-6554-16

Image is for reference, please contact us to get the real picture

Part No :

24-6554-16

Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET ZIF 24POS
Catalog
Sockets for ICs, Transistors
Availability
10102 pieces
Shipped from
HK warehouse
Expected Shipping Date
Oct 29 - Nov 02 2025
PDF
24-6554-16 PDF
Type Description
Series:55
Package:Bulk
Part Status:Active
Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):24 (2 x 12)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Nickel Boron
Contact Finish Thickness - Mating:50.0µin (1.27µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Nickel Boron
Contact Finish Thickness - Post:50.0µin (1.27µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-
24-6554-16 is available at GangBo-ic.com, Please review product page below for detailed information, including 24-6554-16 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 24-6554-16 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

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