180-PLS18007-12

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Part No :: 180-PLS18007-12

Manufacturer: Aries Electronics, Inc.

Description: CONN SOCKET PGA ZIF GOLD

Catalog: Sockets for ICs, Transistors

Availability: 808080 pieces

Shipped from: HK warehouse

Expected Shipping Date: Oct 12 - Oct 16 2025

PDF: 180-PLS18007-12 PDF

Type	Description
Series:	PLS
Package:	Bulk
Part Status:	Active
Type:	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid):	-
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Closed Frame
Termination:	Solder
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Tin
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Material - Post:	Beryllium Copper
Housing Material:	Polyphenylene Sulfide (PPS)
Operating Temperature:	-65°C ~ 125°C

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GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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