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18-3513-11H

18-3513-11H

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Part No :

18-3513-11H

Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET 18POS GOLD
Catalog
Sockets for ICs, Transistors
Availability
048304 pieces
Shipped from
HK warehouse
Expected Shipping Date
Oct 15 - Oct 19 2025
PDF
18-3513-11H PDF
Type Description
Series:Lo-PRO®file, 513
Package:Bulk
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-55°C ~ 105°C
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