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2-382713-1

2-382713-1

CONN IC DIP SOCKET 18POS TIN

2-382713-1

2-382713-1

Image is for reference, please contact us to get the real picture

Part No :

2-382713-1

Manufacturer
TE Connectivity AMP Connectors
Description
CONN IC DIP SOCKET 18POS TIN
Catalog
Sockets for ICs, Transistors
Availability
913591 pieces
Shipped from
HK warehouse
Expected Shipping Date
Jul 23 - Jul 27 2025
PDF
2-382713-1 PDF
Type Description
Series:Diplomate DL
Package:Box
Part Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:-
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:-
Contact Material - Post:Beryllium Copper
Housing Material:Thermoplastic, Glass Filled
Operating Temperature:-55°C ~ 105°C
2-382713-1 is available at GangBo-ic.com, Please review product page below for detailed information, including 2-382713-1 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 2-382713-1 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

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