







MEMS OSC XO 6.0000MHZ H/LV-CMOS
HEATSINK 54X54X15MM XCUT T766
.050 X .050 C.L. FEMALE IDC ASSE
BACKSHELL R/A NON ENV-EMI/RFI 26
| Type | Description |
|---|---|
| Series: | pushPIN™ |
| Package: | Tray |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.00mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | - |
| Fin Height: | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 13.38°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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