







MEMS OSC XO 33.3300MHZ H/LV-CMOS
MEMS OSC XO 6.0000MHZ LVCM LVTTL
MEMS OSC XO 98.3040MHZ LVCMOS LV
HEATSINK 40X40X25MM R-TAB T766
| Type | Description |
|---|---|
| Series: | pushPIN™ |
| Package: | Tray |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | - |
| Fin Height: | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 9.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
|
|
531102B02100GAavid |
BOARD LEVEL HEAT SINK |
|
|
642-60ABT1EWakefield-Vette |
HEATSINK FOR 35MM BGA |
|
|
ATS-02C-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
ATS-14H-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
630-25ABT3Wakefield-Vette |
HEATSINK FOR 35MM BGA |
|
|
909-37-2-23-2-B-0Wakefield-Vette |
HEAT SINK PIN FIN 37X37MM CLIP |
|
|
HSET976-1iBASE Technology |
HEAT SPREADER FOR ET976 (H051HSE |
|
|
ATS-12D-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
901-19-2-21-2-B-0Wakefield-Vette |
HEAT SINK PIN FIN 19X19MM CLIP |
|
|
ATS-15A-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-55210W-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 21X21X24.5MM W/OUT TIM |
|
|
325705R00000GAavid |
BOARD LEVEL HEAT SINK |
|
|
630-45ABT4EWakefield-Vette |
HEATSINK FOR BGAS FIN HGT .45" |