







RES SMD 22K OHM 1% 3/4W 1812
RES 1.54K OHM 1/8W .1% AXIAL
RES 143 OHM 1% 3/4W 1812 SMD
BOARD LEVEL HEAT SINK
| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On and Board Locks |
| Shape: | Rectangular, Fins |
| Length: | 1.250" (31.75mm) |
| Width: | 0.875" (22.22mm) |
| Diameter: | - |
| Fin Height: | 0.250" (6.35mm) |
| Power Dissipation @ Temperature Rise: | 1.5W @ 40°C |
| Thermal Resistance @ Forced Air Flow: | 10.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 22.00°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
|
|
ATS-07E-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
ATS-20C-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
1542199-4TE Connectivity AMP Connectors |
SALEABLE PACKAGED VERSION. |
|
|
ATS-16F-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
D10650-40T4EWakefield-Vette |
HEATSINK 100PQFP COMPOSITE |
|
|
650-BWakefield-Vette |
HEATSINK FOR DIPS |
|
|
ATS-EXL1-1220-R0Advanced Thermal Solutions, Inc. |
HEATSINK AL6063 1220X100X10MM |
|
|
657-10ABPESCWakefield-Vette |
HEATSINK TO-220 W/PINS BLK 1" |
|
|
7-1542003-9TE Connectivity AMP Connectors |
21MM HS ASSY A-TEMP C |
|
|
ATS-55150W-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 15X15X24.5MM W/OUT TIM |
|
|
907-33-1-21-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 33X33MM CLIP |
|
|
ATS-15A-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
662-15ABT5Wakefield-Vette |
HEATSINK EXTRUSION 45MM |