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SIT1602BI-23-28N-19.200000G

SIT1602BI-23-28N-19.200000G

MEMS OSC XO 19.2000MHZ H/LV-CMOS

10157554-01511LF

10157554-01511LF

MINITEK MULTIPITCH 1.25MM RECEPT

A17819-14

A17819-14

TFLEX HD93500,DC1

UTP28X3MGR-Q

UTP28X3MGR-Q

CATEGORY 6A PERFORMANCE 28 AWG U

A17819-14

A17819-14

Image is for reference, please contact us to get the real picture

Part No :

A17819-14

Manufacturer
Laird - Performance Materials
Description
TFLEX HD93500,DC1
Catalog
Thermal - Pads, Sheets
Availability
532853 pieces
Shipped from
HK warehouse
Expected Shipping Date
Jul 31 - Aug 04 2025
Type Description
Series:Tflex™ HD90000
Package:Bulk
Part Status:Active
Usage:-
Type:Gap Filler Pad, Sheet
Shape:Square
Outline:457.20mm x 457.20mm
Thickness:0.140" (3.56mm)
Material:Silicone, Ceramic Filled
Adhesive:Tacky - One Side
Backing, Carrier:-
Color:Gray
Thermal Resistivity:-
Thermal Conductivity:7.5W/m-K
A17819-14 is available at GangBo-ic.com, Please review product page below for detailed information, including A17819-14 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for A17819-14 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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  • Delivery date: usually 2 to 7 working days.
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