CAP CER 10PF 250V NP0 0603
THERM PAD 228.6MMX228.6MM BLUE
IC MCU 8BIT 7KB FLASH 14DIP
IC FPGA 114 I/O 256FBGA
Type | Description |
---|---|
Series: | Fusion® |
Package: | Tray |
Part Status: | Active |
Number of LABs/CLBs: | - |
Number of Logic Elements/Cells: | - |
Total RAM Bits: | 36864 |
Number of I/O: | 114 |
Number of Gates: | 250000 |
Voltage - Supply: | 1.425V ~ 1.575V |
Mounting Type: | Surface Mount |
Operating Temperature: | -40°C ~ 100°C (TJ) |
Package / Case: | 256-LBGA |
Supplier Device Package: | 256-FPBGA (17x17) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
XCKU115-2FLVB1760EXilinx |
IC FPGA 702 I/O 1760FCBGA |
|
5SGXEA9N2F45I2LGIntel |
IC FPGA 840 I/O 1932FCBGA |
|
5SGXEA7K2F35I3GIntel |
IC FPGA 432 I/O 1152FBGA |
|
EP3SE260F1517C4LGIntel |
IC FPGA 976 I/O 1517FBGA |
|
AFS1500-1FGG484Roving Networks / Microchip Technology |
IC FPGA 223 I/O 484FBGA |
|
5SGSMD5H3F35I3GIntel |
IC FPGA 552 I/O 1152FBGA |
|
M2GL060-1FG484Roving Networks / Microchip Technology |
IC FPGA 267 I/O 484FBGA |
|
M1AFS600-1FGG484IRoving Networks / Microchip Technology |
IC FPGA 172 I/O 484FBGA |
|
5AGXMA1D4F27I5GIntel |
IC FPGA 336 I/O 672FBGA |
|
XCKU115-2FLVB2104EXilinx |
IC FPGA 702 I/O 2104FCBGA |
|
XCKU11P-1FFVA1156IXilinx |
IC FPGA 464 I/O 1156FCBGA |
|
5AGZME3H3F35C4GIntel |
IC FPGA 414 I/O 1152FBGA |
|
XCKU11P-2FFVD900EXilinx |
IC FPGA 408 I/O 900FCBGA |