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DEV-16525

DEV-16525

ALCHITRY IO ELEMENT BOARD

TDA18284HN/C1Y

TDA18284HN/C1Y

IC TELECOM INTERFACE

L138-FI-236-RC

L138-FI-236-RC

MOD MITYDSP-L138F OMAP-L138

MAX4758EWX+

MAX4758EWX+

IC INTEGRATED CIRCUIT

L138-FI-236-RC

L138-FI-236-RC

Image is for reference, please contact us to get the real picture

Part No :

L138-FI-236-RC

Manufacturer
Critical Link
Description
MOD MITYDSP-L138F OMAP-L138
Catalog
Embedded - Microcontroller, Microprocessor, FPGA Modules
Availability
820982 pieces
Shipped from
HK warehouse
Expected Shipping Date
May 19 - May 23 2024
Type Description
Series:MityDSP-L138F
Package:Bulk
Part Status:Obsolete
Module/Board Type:MPU, DSP, FPGA Core
Core Processor:ARM926EJ-S, OMAP-L138
Co-Processor:TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
Speed:456MHz
Flash Size:512MB (NAND), 8MB (NOR)
RAM Size:8kB (Internal), 256MB (External)
Connector Type:SO-DIMM-200
Size / Dimension:2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature:-40°C ~ 70°C
L138-FI-236-RC is available at GangBo-ic.com, Please review product page below for detailed information, including L138-FI-236-RC price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for L138-FI-236-RC to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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