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BCM3382EKFEBG

BCM3382EKFEBG

DOCSIS 3.0 DATA MODEM

BCM3382EKFEBG

BCM3382EKFEBG

Image is for reference, please contact us to get the real picture

Part No :

BCM3382EKFEBG

Manufacturer
Broadcom
Description
DOCSIS 3.0 DATA MODEM
Catalog
Embedded - System On Chip (SoC)
Availability
480248 pieces
Shipped from
HK warehouse
Expected Shipping Date
May 18 - May 22 2024
Type Description
Series:*
Package:Tray
Part Status:Obsolete
Architecture:-
Core Processor:-
Flash Size:-
RAM Size:-
Peripherals:-
Connectivity:-
Speed:-
Primary Attributes:-
Operating Temperature:-
Package / Case:-
Supplier Device Package:-
BCM3382EKFEBG is available at GangBo-ic.com, Please review product page below for detailed information, including BCM3382EKFEBG price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for BCM3382EKFEBG to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

  • Please confirm the specifications of the products when ordering.
  • MOQ means the minimum order quantity required to purchase each parts.
  • If you have special order instructions,please note it on the ordering pages.
  • The Pre-Shipment Inspection (PSI) will be applied.
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  • Credits can be used on the second and subsequent orders.
  • The credits are valid for two years from the date your last purchase.
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