BOARD EVAL FOR AS1363-18
EMBEDDED MODULE WITH OPTICAL AFE
IC IMAGE SENSOR CCD 24CDIP
IC MCU 16BIT 32KB FLASH 20LSSOP
Type | Description |
---|---|
Series: | - |
Package: | Tray |
Part Status: | Active |
Type: | Biometric Sensor Hub |
Input Type: | Digital |
Output Type: | I²C, SPI |
Current - Supply: | - |
Operating Temperature: | 0°C ~ 70°C |
Mounting Type: | Surface Mount |
Package / Case: | 38-VFLGA Module |
Supplier Device Package: | 38-OLGA (4.1x4.5) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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ZSSC3138BE1DRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
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ZSSC3136BE1CRenesas Electronics America |
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MLX90320LFR-BBA-000-TUMelexis |
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ZSC31150GACRenesas Electronics America |
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UPD9280GM-UEU-ARochester Electronics |
VIDEO IMAGE UPSCALER |
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ZSSC3131BE1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
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ZSSC3123AI1CRenesas Electronics America |
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AFE VIDEO ADC 14 BIT 3V |
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FTF1100MF1V2.1Rochester Electronics |
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ZSSC3136BA1CRenesas Electronics America |
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GH65C11-C-SOGrayhill, Inc. |
ENDCODER OPTICAL |
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ZSSC4171BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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TDC-GPX2FLQMams |
TDC-GPX2 FLQM LQFP64 LF T&RDP |