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ZSSC3027AI1D ES

ZSSC3027AI1D ES

DICE (WAFER SAWN) - WAFFLE PACK

ZSSC3027AI1D ES

ZSSC3027AI1D ES

Image is for reference, please contact us to get the real picture

Part No :

ZSSC3027AI1D ES

Manufacturer
Renesas Electronics America
Description
DICE (WAFER SAWN) - WAFFLE PACK
Catalog
Interface - Sensor and Detector Interfaces
Availability
248124 pieces
Shipped from
HK warehouse
Expected Shipping Date
May 21 - May 25 2024
Type Description
Series:*
Package:Tray
Part Status:Active
Type:-
Input Type:-
Output Type:-
Current - Supply:-
Operating Temperature:-
Mounting Type:-
Package / Case:-
Supplier Device Package:-
ZSSC3027AI1D ES is available at GangBo-ic.com, Please review product page below for detailed information, including ZSSC3027AI1D ES price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for ZSSC3027AI1D ES to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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