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XC17S200APDG8I

XC17S200APDG8I

IC PROM SER 200K I-TEMP 8-DIP

XC17S200APDG8I

XC17S200APDG8I

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Part No :

XC17S200APDG8I

Manufacturer
Xilinx
Description
IC PROM SER 200K I-TEMP 8-DIP
Catalog
Memory - Configuration Proms for FPGAs
Availability
115711 pieces
Shipped from
HK warehouse
Expected Shipping Date
May 11 - May 15 2024
PDF
XC17S200APDG8I PDF
Type Description
Series:-
Package:Tube
Part Status:Obsolete
Programmable Type:OTP
Memory Size:2Mb
Voltage - Supply:3V ~ 3.6V
Operating Temperature:-40°C ~ 85°C
Mounting Type:Through Hole
Package / Case:8-DIP (0.300", 7.62mm)
Supplier Device Package:8-PDIP
XC17S200APDG8I is available at GangBo-ic.com, Please review product page below for detailed information, including XC17S200APDG8I price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for XC17S200APDG8I to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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